The invention relates to a heating assembly for an aerosol-generating device. The heating assembly may comprise a first solder spot and a second solder spot. The heating assembly may further comprise a connection strip electrically connecting the first solder spot with the second solder spot. One of the first solder spot and the second solder spot may be configured as a soft solder spot with a melting temperature between 200 °C and 300 °C. The connection strip may be configured as a bimetal strip. The invention further relates to an aerosol-generating device comprising the heating assembly.