Hierarchical curing regulation and interpenetrating network construction of BT resin via multi-component additives: Synergistic enhancement of dielectric properties and dimensional stability for high-frequency packaging
Fuente:
Composites
Publication date: 18 August 2026Source: Composites Science and Technology, Volume 283Author(s): Linyan Zhu, Wenguang Zhang, Jiaming Wang, Yabin Zhang, Runze Liu, Yuming Lu, Lishuai Zong, Jinyan Wang, Xigao Jian