Electrical insulation EMI shielding epoxy-based composites with low thermal expansion for advanced electronic packaging
Fuente:
Composites
Publication date: 5 January 2026Source: Composites Science and Technology, Volume 273Author(s): Zeyu Zheng, Kuan Deng, Yang Liu, Hebin Zhang, Weijing Wu, Yan-Jun Wan, Rong Sun, Pengli Zhu