Fuente: Journal of applied polymer Lugar: REVIEW Phonon generation and scattering mechanisms in thermal conduction.


ABSTRACT
With the ongoing evolution of electrical equipment, particularly next-generation power semiconductor devices, toward higher integration, lighter weight, and more extreme operating conditions, issues such as overheating, insulation breakdown, and material cracking have become increasingly prominent. To guarantee operational reliability, the thermal conductivity and electrical insulation properties of packaging materials (such as epoxy resin and silicone gel) must align with the demands of high-performance devices. This review centers on the encapsulation needs of electrical equipment and addresses the inherent conflict between thermal conductivity and dielectric breakdown strength. It systematically examines recent progress in the electrical insulation and heat transfer performance of packaging materials, with a specific emphasis on liquid crystalline epoxy-based systems. Firstly, the underlying physical mechanisms and associated theoretical models related to thermal conduction and breakdown strength are analyzed. Subsequently, a focused overview of recent advancements in the thermal and electrical properties of liquid crystalline epoxy resins and their composite materials is provided. Finally, current challenges and prospective research directions for liquid crystalline epoxy resins in packaging applications are outlined, along with a discussion of potential hurdles and future opportunities for further development.