Fuente: Wipo "precision farming" A semiconductor package structure includes a first semiconductor component, a second semiconductor component, a bonded structure, a first through-substrate via, a pad, and a conductive feature. The first semiconductor component includes a first substrate and a first interconnect structure electrically connecting the first through-substrate via to the pad. The first interconnect structure is disposed over a first side of the first substrate. The second semiconductor component includes a second substrate and a second interconnect structure. The first through-substrate via penetrates the first substrate from a second side to the first side. The second side is opposite to the first side. The pad is disposed over the second side of the first substrate. The conductive feature is disposed over the second side of the first substrate and between the first through-substrate via and the pad. The conductive feature is electrically connected to the first interconnect structure by the first through-substrate via.