Fecha de publicación: 28/02/2002 Fuente: Wipo "Sensorization" A semiconductor sensor chip is interposed between a sensor case and a housing. A first pressure is introduced from the sensor case and applied to a rear surface of the sensor chip, while a second pressure is introduced from the housing and applied to a front surface of the sensor chip. The sensor chip detects a pressure difference between the first and the second pressures and converts it into an electrical signal. The sensor chip is hermetically mounted in a depressed portion formed in the sensor case by charging a sealing material from holes formed around the depressed portion. The charging holes are positioned between terminals electrically connecting the sensor chip to an outside circuit to avoid enlarging the pressure sensor size by forming the charging holes.