Fuente: Wipo "Sensorization" The invention provides a machining system (201) comprising: a machining apparatus (202), notably an abrasive waterjet cutting system (203), said machining apparatus being adapted for machining a workpiece (204); a monitoring device (228) adapted for monitoring machining conditions of the machining apparatus (202) and/or of the workpiece, the monitoring device comprising a plurality of sensors, said plurality of sensors comprising a first sensor (237) at a first location and a second sensor (239) at a second location which is distant from the first location. The plurality of sensors comprises a fourth sensor (243) which is formed by an array of microphones (254) arranged on a grid. The plurality of sensors comprises accelerometers, strain gauges and microphones. The invention also provides a monitoring method of a machining system (201) wherein a specific benchmark signature is chosen from a library.