Modified Si3N4 filler enhancing the energy storage performance and thermal stability of a P(VDF‐HFP) based composite

Fecha de publicación: 13/11/2024
Fuente: Journal of applied polymer
Lugar: RESEARCH ARTICLE
Si3N4 particles were modified using KH-570. The OCH3 functional group of KH-570 undergoes hydrolysis in the presence of water, generating active SiOH. These SiOH can chemically bond or physically adsorb with OH on the surface of Si3N4, forming an organic adsorption layer on the surface of Si3N4. Using modified Si3N4 as filler and P(VDF-HFP) as matrix, when the mass fraction of mSi3N4 is 7.5 wt%, the recoverable energy density (W
rec) of the mSi3N4/P(VDF-HFP) composite film reaches to 1.79 J/cm3 under a 125 MV/m electric field, which is 82.7% higher than pure P(VDF-HFP).


Abstract
To improve the high-temperature stability of poly(vinylidene fluoride hexafluoropropylene) P(VDF-HFP)-based composite film for its potential application in energy storage, the modified silicon nitride (mSi3N4) nanoparticles are fabricated using silane coupling agent (KH-570) and introduced into P(VDF-HFP). When the mass fraction of mSi3N4 is 7.5 wt%, the recoverable energy density (W
rec) of the mSi3N4/ P(VDF-HFP) composite film reaches to 1.79 J/cm3 under a 125 MV/m electric field, which is 82.7% higher than pure P(VDF-HFP). Interestingly, the dielectric properties of mSi3N4/P(VDF-HFP) show a considerable thermal stability at a high-frequency ranging from −20 to 160°C, providing an effective approach for preparing energy storage composites working for high-temperature environments.