Fluorinated bismaleimide thermosets with dynamic boronic ester Crosslinks: Overcoming Irreparable Cracking and Non‑Recyclability via topological rearrangement for Low-Dielectric electronic packaging
Fuente:
European Polymer Journal
Publication date: 23 October 2026Source: European Polymer Journal, Volume 258Author(s): Yuan Li, Ziqi Dai, Junhang Zhang, Xianghua Wang, Yuan Cao, Yuxi Sun, Nian He, Yanping Huo, Shaomin Ji