Thermo-mechanical coupled separation of high-value BGA components from waste mobile-phone printed circuit boards
Fuente:
Waste Management
Publication date: 1 January 2027Source: Waste Management, Volume 227Author(s): Jingfu Xu, Chenglong Zhang, Qiyu Duan, Zhengzhong Zhao, Ruixue Wang, Xiaonuan Wang, En Ma, Xiaoling Guo